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A modelling approach to assess the creep behaviour of large-area solder joints
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2000
Conference Paper
Title
A modelling approach to assess the creep behaviour of large-area solder joints
Author(s)
Poech, M.H.
Eisele, R.
Mainwork
Reliability of electron devices, failure physics and analysis
Conference
European Symposium on Reliability of Electron Devices, Failure Physics and Analysis (ESREF) 2000
DOI
10.1016/S0026-2714(00)00184-0
Language
English
Fraunhofer-Institut für Siliziumtechnologie ISIT