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Microdeformation analysis of packages and interconnects by the MicroDAC method
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1998
Conference Paper
Title
Microdeformation analysis of packages and interconnects by the MicroDAC method
Author(s)
Vogel, D.
Kaulfersch, E.
Michel, B.
Mainwork
Workshop on Mechanical Reliability of Polymeric Materials and Plastic Packages of IC Devices 1998. Proceedings
Conference
Workshop on Mechanical Reliability of Polymeric Materials and Plastic Packages of IC Devices 1998
Language
English
Fraunhofer-Institut für Zuverlässigkeit und Mikrointegration IZM
