Method for rapid testing of thermo-mechanical characteristics of solder joints

The creep behavior of alternative soft solder alloys is not, as a rule, well known. This characteristic is however very important for the prediction of a joint's long-term reliability. Conventional test methods are often impractical, slow and deliver only qualitative results. The new testing method presented is able to provide very fast quantitative values of thermo-mechanical characteristics. This paper shows latest results, comparison with standard testing, investigation of high temperature applications and new fields of use.