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2008
Journal Article
Title

Development of innovative particleboard panels

Abstract
One aim of a joint European project called DIPP (Development of Innovative Particleboard (chipboard) Panels for a better mechanical performance and a lower environmental impact) is the development of lightweight particleboards made from annual/perennial farm plants such as hemp, sunflower, topinambur, maize and miscanthus. These lightweight particleboards are intended as a possible substitution for traditional wood-based particleboards used in the furniture industry. Therefore the requirements of the EN 312 concerning the moisture-related and mechanical properties of boards for interior use have to be met. The results of research have shown that the internal bond strength of one-layer lightweight particleboards made in the experiment meets the requirements of EN 312 (type P2) and the internal bond strength of three-layer boards with topinambur in the core layer does not meet these requirement. The lightweight boards failed to meet the requirements of modulus of elastici ty and bending strength.
Author(s)
Balducci, F.
Harper, C.
Meinlschmidt, P.
Dix, B.
Sanasi, A.
Journal
Drvna Industrija  
Language
English
Fraunhofer-Institut für Holzforschung Wilhelm-Klauditz-Institut WKI  
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