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  4. 40 GHz InP-based photoreceiver OEICs: Application for 40 Gb/s TDM systems and beyond
 
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2000
Conference Paper
Title

40 GHz InP-based photoreceiver OEICs: Application for 40 Gb/s TDM systems and beyond

Abstract
Progress of 40 Gb/s photoreceiver OEICs for 1.55 mu m TDM systems is described. The OEICs comprise side-illuminated photodiodes and amplifiers, based on the traveling wave concept. Results from packaged OEICs into pig-tailed modules are given.
Author(s)
Bach, H.G.
Schlaak, W.
Mekonnen, G.G.
Umbach, A.
Schramm, C.
Unterborsch, G.
Passenberg, W.
Mainwork
Integrated Photonics Research 2000. Postconference edition  
Conference
Conference "Integrated Photonics Research" 2000  
Language
English
Fraunhofer-Institut für Nachrichtentechnik, Heinrich-Hertz-Institut HHI  
Keyword(s)
  • HEMT integrated circuits

  • iii-v semiconductors

  • indium compounds

  • integrated circuit packaging

  • integrated optoelectronics

  • mmic amplifiers

  • optical receivers

  • photodiodes

  • time division multiplexing

  • travelling wave amplifiers

  • InP-based photoreceiver oeics

  • 40 gb/s tdm systems

  • side-illuminated photodiodes

  • amplifiers

  • traveling wave concept

  • packaged oeics

  • pig-tailed modules

  • waveguide-integrated photodiode

  • HEMT-based amplifier

  • photoreceiver oeics

  • traveling wave amplifiers

  • 40 GHz

  • 40 Gbit/s

  • 1.55 micron

  • GaInAsP-InP

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