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  4. 3D-integration: Challenges and proposals
 
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2012
Conference Paper
Title

3D-integration: Challenges and proposals

Abstract
The first integrated circuits contained only a few transistors. Today, with the progressive miniaturization, complete systems can be realized on a chip. These are called system-on-chip. One example is the modern micro-controller which is the heart of many applications. They combine a processor, a memory and an analog-digital and a digital-analog converter that allows the evaluation of sensor data or the control of processes. Still, the integration of analog and digital circuits in a common semiconductor process is a major challenge in the design. While transistor sizes of digital circuits become smaller it is difficult to scale analog circuits since the transistor sizing depends on the driven currents. The integration of different sub-systems, therefore, often requires compromises in performance, power consumption, and design and manufacturing costs. Modern integration methods that combine several different IC in one package bridge this gap.
Author(s)
Dietrich, Manfred
Fraunhofer-Institut für Integrierte Schaltungen IIS  
Heinig, Andy  
Fraunhofer-Institut für Integrierte Schaltungen IIS  
Knöchel, Uwe
Fraunhofer-Institut für Integrierte Schaltungen IIS  
Mainwork
19th Electronic Devices and Systems - IMAPS CS International Conference 2012  
Conference
Electronic Devices and Systems International Conference (EDS) 2012  
File(s)
Download (694.1 KB)
Rights
Use according to copyright law
DOI
10.24406/publica-fhg-376329
Language
English
Fraunhofer-Institut für Integrierte Schaltungen IIS  
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