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Study on reflowable underfill materials for different flip chip processes
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2000
Conference Paper
Title
Study on reflowable underfill materials for different flip chip processes
Author(s)
Kallmayer, C.
Becker, K.-F.
Jung, E.
Aschenbrenner, R.
Reichl, H.
Mainwork
ECTC 2000. Proceedings of the 50th Electronic Components & Technology Conference
Conference
Electronic Components and Technology Conference (ECTC) 2000
Language
English
Fraunhofer-Institut für Zuverlässigkeit und Mikrointegration IZM
