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A new production line for low cost flip chip assembly
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1997
Conference Paper
Title
A new production line for low cost flip chip assembly
Author(s)
Kutzner, K.
Kloeser, J.
Kappeler, U.
Aschenbrenner, R.
Reichl, H.
Mainwork
Area array packaging technologies
Conference
Workshop on Flip Chip, CSP and Ball Grid Arrays 1997
Language
English
Fraunhofer-Institut für Zuverlässigkeit und Mikrointegration IZM
