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  4. Reliability of electroless nickel for high temperature applications
 
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1999
Conference Paper
Title

Reliability of electroless nickel for high temperature applications

Author(s)
Anhöck, S.
Ostmann, A.
Oppermann, H.
Aschenbrenner, R.
Reichl, H.
Mainwork
International Symposium on Advanced Packaging Materials 1999: Processes, Properties and Interfaces. Proceedings  
Conference
International Symposium on Advanced Packaging Materials 1999  
Language
English
Fraunhofer-Institut für Zuverlässigkeit und Mikrointegration IZM  
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