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Reliability Evaluations of Lead Free Soldered Packages
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2003
Conference Paper
Title
Reliability Evaluations of Lead Free Soldered Packages
Author(s)
Walter, H.
Auerswald, E.
Schubert, A.
Dudek, R.
Michel, B.
Mainwork
Towards implementation of the RHS directive. IPC/SOLDERTEC Global Conference on Lead Free Electronics 2003. Vol.2
Conference
Global Conference on Lead Free Electronics 2003
Language
English
Fraunhofer-Institut für Zuverlässigkeit und Mikrointegration IZM
