Analysis and evaluation of handling components

Challenges for automated handling are getting more and more demanding due to thinner and more fragile wafers in photovoltaic production lines. This leads to new and sophisticated developments for the handling components. The Evaluation of new gripper variants is necessary before the implementation in the production lines to minimize the risk. Therefore a new experimental approach for analysis and evaluation of wafer grippers is presented. First analysis results give an overview about the different behavior of the grippers and a first idea about the best gripper solution for dedicated requirements.