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Long-time reliability study of soldered flip chips on flexible substrates
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2004
Journal Article
Title
Long-time reliability study of soldered flip chips on flexible substrates
Author(s)
Pahl, B.
Kallmayer, C.
Aschenbrenner, R.
Reichl, H.
Journal
Microelectronics reliability
DOI
10.1016/j.microrel.2003.10.006
Language
English
Fraunhofer-Institut für Zuverlässigkeit und Mikrointegration IZM
