Portability is expected to continue being a strong driver of new packaging approaches and the area saved on a PWB make new product features possible that can be used for sales promotion. For example altimeters and barometers are incorporated already in clocks and pocket knives [1; 2]. So there is a need of fully linearized pressure sensor systems with small temperature drift and small form factor, i.e. calibrated pressure sensors ideally for flip-chip assembly. Since the handling of chip scale packaged pressure sensors is quite complicated new calibration strategies have to be developed. FhG-IMS Duisburg has set up a method for on-wafer calibration of integrated pressure sensors.