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2010
Conference Paper
Title
Cohesive toughness of low-k film with periodically changing elastic modulus: Cube-corner indentation
Abstract
The through-thickness cohesive toughness is estd. by applying the cube-corner indentation method for an organosilicate glass (OSG), cured by monochromatic UV irradn. to obtain oscillating elastic moduli across the film thickness. Radial cracks induced by cube-corner indentation on as-deposited OSG film shows a straight crack path, while the indentation on OSG film with elastic modulus oscillation shows a disturbed crack path. The cohesive toughness increases from (0.059±0.001) MPa.m1/2 to (0.063±0.001) MPa.m1/2 after monochromatic UV curing. (c) 2010 American Institute of Physics.