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Materials science and engineering. A major topic in the future of microelectronic packaging
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1997
Conference Paper
Title
Materials science and engineering. A major topic in the future of microelectronic packaging
Author(s)
Reichl, H.
Wolf, J.
Mainwork
Micro Materials. Micro Mat '97. Proceedings
Conference
Micro Materials (Micro Mat) 1997
Language
English
Fraunhofer-Institut für Zuverlässigkeit und Mikrointegration IZM