Adhesive-based self-alignment mechanisms for modular stacked microsystems

The development of modularly designed systems could provide a cost-effective alternative to state-of-the-art manufactured microsystems. The purpose of this research was to develop a robust, cost-effective and low-temperature module assembly for the production of modular stacked systems with high positioning precision. To achieve this aim, a new alternative self-alignment process using the surface tension of a resin as a driving force was examined. This was then followed by characterization, simulation and optimization for self-assembly. The experimental results show that viscosity is the main parameter for the self-alignment capability of an adhesive. Furthermore, successful resin self-alignment requires both solid edge and edge treatment. Better results were achieved by dispensing the adhesive by the cross pattern then by the square pattern. In the two-dimensional simulation, it was shown that the self-alignment has a laminar aperiodic motion and the largest aligning forces occur at the beginning of the process.