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1996
Journal Article
Title

Kleben mit kleinsten Klebstoffmengen

Abstract
The application of very small amounts of adhesives is shown. Single drops between 5 pl and 500 pl are applicable with up to 2000 drops per second. Two component adhesives are mixed by meeting the drops of the single drops either in the air or on the substrate. Silicone is bonded by a two component epoxy resin. It was found, that the resin does not cure completely if a distant thickness of the layer of the adhesive falls short of. The reason for this behaviour is examined in further studies.
Author(s)
Hartwig, A.
Döring, M.
Hennemann, O.-D.
Journal
Adhäsion. Kleben und Dichten  
Language
English
Fraunhofer-Institut für Fertigungstechnik und Angewandte Materialforschung IFAM  
Keyword(s)
  • adhesive bonding

  • application technology

  • Dosiertechnik

  • dünne Klebstoffschicht

  • Kleben

  • micro system technology

  • Mikrosystemtechnik

  • picolitre

  • Pikoliter

  • thin layer

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