Concepts for ultra thin packaging technologies

As the number of applications for flexible assemblies is growing there is also a larger variation of requirements for such packages. Therefore different technologies have been developed for applications from CSP's to smart cards. The scope of the paper is to describe different approaches for packaging using ultra-thin and flexible chips. This includes the assembly processes as well as packaging concepts e.g. CSP's, 3D modules and volumetric integration of passive and active components into modules and substrates.