Technologische Aspekte für das Kleben in der Mikrofügetechnik

In future there will be much more special materials for electronic applications and its joining techniques will be decisive importance. The final joining technique must be suitable for massproduction and has to consider the specialities of electronics and microelectronics. There are already examples for adhesive bonding technique of surface mounted devices. It seems to be that there is a large future potential for further applications in new products.