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  4. Correlation between mechanical properties and microstructure of different aluminum wire qualities after ultrasonic bonding
 
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2015
Journal Article
Title

Correlation between mechanical properties and microstructure of different aluminum wire qualities after ultrasonic bonding

Abstract
Three different heavy aluminum wire qualities were investigated regarding their microstructural evolution after ultrasonic bonding by electron backscatter diffraction and nanoindentation. The results complete the findings of our recent research regarding the effect of bonding mechanisms on the wire bond microstructure and its local mechanical properties. Local elastic-plastic material parameters of the bonded wires were approximated on the basis of the elastic anisotropy of crystals and a correlation between hardness and stress.
Author(s)
Broll, Marian Sebastian
Geißler, U.
Höfer, J.
Schmitz, S.
Wittler, O.
Schneider-Ramelow, M.
Lang, K.-D.
Journal
Microelectronics reliability  
Conference
European Symposium on Reliability of Electron Devices, Failure Physics and Analysis (ESREF) 2015  
DOI
10.1016/j.microrel.2015.06.061
Language
English
Fraunhofer-Institut für Zuverlässigkeit und Mikrointegration IZM  
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