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  4. Selective Induction Heating of Metallic Microstructures for Wafer-Level MEMS Packaging
 
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2019
Conference Paper
Title

Selective Induction Heating of Metallic Microstructures for Wafer-Level MEMS Packaging

Author(s)
Froehlich, A.
Hofmann, Christian
Rochala, P.
Kimme, J.
Kroll, M.
Kraeusel, V.
Mainwork
HES-19, International Conference on Heating by Electromagnetic Sources  
Conference
International Conference on Heating by Electromagnetic Sources (HES) 2019  
Language
English
Fraunhofer-Institut für Elektronische Nanosysteme ENAS  
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