Selective Metallisation of 3-D Plastic Parts

Molded Interconnect Devices (MID) technology is relatively new for the manufacturing of components with integrated electrical and mechanical functions. The electrical functions are achieved by partial metallisation of the plastic substrates. In this paper, a electroless copper process for the selective metallisation of LCP (Liquid Crystal Polymer) is presented. Neuronal network-based quality concepts for the molding process of the plastic substrates are discussed.