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3D-integrated Si- and SiGe CMOS-devices by ICV-SLID technology
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2007
Conference Paper
Title
3D-integrated Si- and SiGe CMOS-devices by ICV-SLID technology
Author(s)
Wieland, R.
Ecke, R.
Klumpp, A.
Merkel, R.
Schulz, S.E.
Ramm, P.
Mainwork
Smart systems integration 2007
Conference
European Conference & Exhibition on Integration Issues of Miniaturized Systems - MEMS, MOEMS, ICs and Electronic Components 2007
Language
English
Fraunhofer-Institut für Elektronische Nanosysteme ENAS
Fraunhofer-Institut für Zuverlässigkeit und Mikrointegration IZM
