Funktionalisierung, Metallisierung und Strukturierung von Schaltungsträgern für die Aufbau- und Verbindungstechnik in der Elektronik

In order to choose the most appropriate processes to use for assembly manufacture, a number of factors have to be considered. These include the type of substrate material, the metallisation process used, what patterning methods are available and what surface outer finish will be used. Among the most marketable products are flex circuit boards for cellphones and those for use at elevated temperatures and in the HF range. The aim, wherever possible, is to minimise production costs by use of reel-to-reel technology on a continuous production basis.