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  4. SOI pixel detector based on CMOS time-compression charge-injection
 
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2007
Conference Paper
Title

SOI pixel detector based on CMOS time-compression charge-injection

Abstract
Concept and experimental results obtained from a pixel detector based on CMOS Time-Compression Charge-Injection-Devices (TC-CID) with a huge internal photocurrent amplification (~104), fabricated in CMOS Silicon-On-Insulator (SOI)technology are presented. Here, the readout circuitry is fabricated on highly-doped, 200nm thick SOI film, while the photogate (PG) detector is fabricated on higher-resistivity handle wafer. The latter, together with the 30V biasing possibilities enhanced the quantum efficiency, especially for irradiations with wavelengths in the near-infra-red (NIR) part of the spectra.
Author(s)
Durini, D.
MES
Brockherde, W.
Fraunhofer-Institut für Mikroelektronische Schaltungen und Systeme IMS  
Hosticka, B.J.
Fraunhofer-Institut für Mikroelektronische Schaltungen und Systeme IMS  
Mainwork
ECCTD 2007,18th European Conference on Circuit Theory and Design  
Conference
European Conference on Circuit Theory and Design (ECCTD) 2007  
DOI
10.1109/ECCTD.2007.4529754
Language
English
Fraunhofer-Institut für Mikroelektronische Schaltungen und Systeme IMS  
Keyword(s)
  • CMOS imaging

  • SOI based charge-injection pixel

  • time-compression charge-injection devices

  • TC-CID

  • SOI high-voltage CMOS process imaging

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