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A new approach for system integrated packaging
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2000
Conference Paper
Title
A new approach for system integrated packaging
Author(s)
Aschenbrenner, R.
Jung, E.
Ostmann, A.
Landesberger, C.
Reichl, H.
Mainwork
3rd Electronics Packaging Technology Conference (EPTC 2000). Proceedings
Conference
Electronics Packaging Technology Conference (EPTC) 2000
Language
English
Fraunhofer-Institut für Zuverlässigkeit und Mikrointegration IZM