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  4. A new approach for system integrated packaging
 
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2000
Conference Paper
Title

A new approach for system integrated packaging

Author(s)
Aschenbrenner, R.
Jung, E.
Ostmann, A.
Landesberger, C.
Reichl, H.
Mainwork
3rd Electronics Packaging Technology Conference (EPTC 2000). Proceedings  
Conference
Electronics Packaging Technology Conference (EPTC) 2000  
Language
English
Fraunhofer-Institut für Zuverlässigkeit und Mikrointegration IZM  
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