High Density Interposer - Challenges and Opportunities

Within "More than Moore" concepts interposer based packaging technologies, know as 2.5 D/3D Wafer Level System Integration, open up a wide range of minaturized multi-functional sytem Solutions. Pending of the final application dedicated interposer concepts have beend developed for grabbing multiople active components, fabricated by different suppliers, using different Technologies and materials, e.g. sensors, logic, Radio frequency (RF) and momory-ICs, as well as passive devices, including antennas. In many cases the application of high density wiring, miceo pillar (µ-pillar) interconnectsa as well as Through Silicon Vias (TSVs) are required. Finally the interposer needs to provide the mechanical basemente for system packages. In order to support system miniaturization and extension of system performance on one hand and to meet costs an time to market challenges on the other hand the development of modular interposer concepts as well as the application of dedicated basic interposer technologies is of high interest for R&D, prototyping and small volume manufacturing. A short outline of high density interposer technologies developed and available at Fraunhofer IZM on 300 mm substrates will be presented. Starting with a brief discussíon of basic elements of interposers, several technology concepts dveloped and validated for high density wiring will be addressed and generic results will be presented. A high level comparsion of challenges and opportunities will be shown and discussed. A brief outlook of future development work for system applications will be given.