Inline monitoring of epoxy molding compound in transfer molding process for smart power modules
Abstract
The quality of smart power modules strongly depends on the material characteristics of epoxy molding compound (EMC) and transfer molding process parameters. In order to predict the quality and to diminish the failure mechanisms, inline monitoring techniques in transfer molding process are essential. This work examines the inline identification of the variations in the EMC characteristics in the transfer molding process. Dielectric Analysis (DEA) is chosen as an inline technique and the influence of prolonged storage duration, moisture content and batch-To-batch variation on the characteristics of EMC are studied. In addition, the impact of molding temperature on the cure behavior of the EMC is in-situ examined. DEA results are verified and compared with the rheological and calorimetric analysis and good correlation is established.
