1995
Conference Paper
Titel

Materialeinflüsse beim Drahtbonden von Chip-on-Board- und Chip-on-Glass-Komponenten
Alternative
Materials influences on wire bonding of chip-on-board and chip-on-glass components
Author(s)
Lang, K.-D.
Krabe, D.
Reichl, H.
Hauptwerk
Konferenz
Thumbnail Image
Language
German