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  4. Chip Formation and Sub-surface Damage in Ductile Mode Grinding of Semiconductors
 
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1998
Conference Paper
Title

Chip Formation and Sub-surface Damage in Ductile Mode Grinding of Semiconductors

Author(s)
Uhlmann, E.
Engel, H.
Paesler, C.
Mainwork
American Society for Precision Engineering. 13th Annual Meeting 1998. Proceedings  
Conference
American Society for Precision Engineering (Annual Meeting) 1998  
Language
English
Fraunhofer-Institut für Produktionsanlagen und Konstruktionstechnik IPK  
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