2013
Poster
Title

Wafer level vacuum packaging of micro-mirrors with buried wiring

Title Supplement
Poster presented at WaferBond 2013, Conference on Wafer Bonding for Microsystems, 3D- and Wafer Level Integration; 5th- 6th December 2013, Stockholm, Sweden
Author(s)
Langa, Sergiu  
Drabe, Christian  
Herrmann, Andreas  
Ludewig, Thomas  
Rieck, Andreas  
Flemming, André  
Kaden, Christiane
Conference
File(s)
Rights
Use according to copyright law
DOI
Language
English