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  4. High-temperature modeling of AlGaN/GaN HEMTs
 
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2010
Journal Article
Title

High-temperature modeling of AlGaN/GaN HEMTs

Abstract
Wide bandgap, high saturation velocity, and high thermal stability are some of the properties of GaN, which make it an excellent material for high-power, high-frequency, and high-temperature applications. As several application areas require the devices to operate at elevated temperatures, a proper modeling of the temperature dependences of the band structure and transport parameters is very important. We present two-dimensional hydrodynamic simulations of AlGaN/GaN high electron mobility transistors (HEMTs) at high temperatures. The simulator is calibrated against measurement data of a real device and delivers good predictive results for the DC and RF characteristics of another. The temperature dependence of the maximum current and cut-off frequency of submicron devices is further studied.
Author(s)
Vitanov, S.
Palankovski, V.
Maroldt, S.
Fraunhofer-Institut für Angewandte Festkörperphysik IAF  
Quay, Rüdiger  orcid-logo
Fraunhofer-Institut für Angewandte Festkörperphysik IAF  
Journal
Solid-State Electronics  
Conference
International Semiconductor Device Research Symposium (ISDRS) 2009  
DOI
10.1016/j.sse.2010.05.026
Language
English
Fraunhofer-Institut für Angewandte Festkörperphysik IAF  
Keyword(s)
  • AlGaN/GaN

  • HEMT

  • high temperature

  • modeling

  • simulation

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