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2003
Conference Paper
Titel
Embedded life-cycle information module for monitoring and identification of product use conditions
Abstract
Information on product use conditions is essential for sound strategies of product service as well as takeback, refurbishing, reuse of components, or recycling. Further, it could improve design, market research and quality management. This paper describes modular concepts for life-cycle monitoring, identification of use conditions, reliability assessment and diagnosis. MEMS-based prototypes are discussed, which measure, identify, and record data strongly correlated with the degradation of a product during its use phase. They are designed to get embedded in various products. The product's remaining life can be estimated during its use by dedicated algorithms implemented in the data processing unit. The recorded data can be retrieved either during the use stage or after product takeback.