Flip chip assembly and reliability using gold/tin solder bumps

2004

Conference Paper

Abstract

Flip chip assembly and reliability using gold/tin solder bumps.

Author(s)

Oppermann, H.

Hutter, M.

Klein, M.

Reichl, H.

Hauptwerk

Micro-Optics. Fabrication, Packaging, and Integration

Konferenz

Photonics Europe Symposium 2004

Conference "Micro-Optics - Fabrication, Packaging and Integration" 2004