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  4. High-precision flip-chip technology for alloptical wavelength conversion using SOI photonic circuit
 
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2011
Conference Paper
Titel

High-precision flip-chip technology for alloptical wavelength conversion using SOI photonic circuit

Abstract
High-precision hybrid integration on SOI photonic circuit was developed. The technology was applied to fabricate an integrated high-speed all-optical wavelength converter. Potential of the platform was demonstrated by 40Gb/s all-optical wavelength switching
Author(s)
Zimmermann, L.
Preve, G.B.
Voigt, K.
Winzer, G.
Kreissl, J.
Moerl, L.
Stamatiadis, C.
Stampoulidis, L.
Avramopoulos, H.
Hauptwerk
8th IEEE International Conference on Group IV Photonics (GFP), 2011
Konferenz
International Conference on Group IV Photonics (GFP) 2011
Thumbnail Image
DOI
10.1109/GROUP4.2011.6053775
Language
English
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Fraunhofer-Institut für Nachrichtentechnik, Heinrich-Hertz-Institut HHI
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