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  4. Development of Temperature Resistant Joints - Testing and Influences
 
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2000
Conference Paper
Titel

Development of Temperature Resistant Joints - Testing and Influences

Author(s)
Nowottnick, M.
Scheel, W.
Wittke, K.
Pape, U.
Schulz, J.
Hauptwerk
European Microelectronics Packaging and Interconnection Symposium 2000. Proceedings
Konferenz
European Microelectronics Packaging and Interconnection Symposium 2000
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Language
English
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Fraunhofer-Institut für Zuverlässigkeit und Mikrointegration IZM
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