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  4. Shear stress effects on the device characteristics determined with indentation testing : Student paper
 
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2021
Conference Paper
Title

Shear stress effects on the device characteristics determined with indentation testing : Student paper

Abstract
An indentation approach is introduced to study the effects of shear stress on the transistor characteristics with controlled indentation experiments. An aligned cylinder tip with a defined contact angle relative to the transistor channel direction is proposed to selectively strain the silicon channels in order to induce significant shear stress. Ring oscillator circuits based on NAND and NOR gates monitor the stress effects on the characteristic circuit frequency as well as on the individual transistors. Finite Element simulations help to identify optimized setup properties for the targeted application. Comparison with previous indentation experiments derives the specific influence of each stress tensor component on the transistor characteristics.
Author(s)
Schlipf, Simon
Fraunhofer-Institut für Keramische Technologien und Systeme IKTS  
Clausner, André  
Fraunhofer-Institut für Keramische Technologien und Systeme IKTS  
Paul, Jens
Global Foundries, Germany
Capecchi, Simone
Global Foundries, Germany
Zschech, Ehrenfried
Fraunhofer-Institut für Keramische Technologien und Systeme IKTS  
Mainwork
IEEE International Integrated Reliability Workshop Final Report
Funder
Bundesministerium für Wirtschaft und Energie
Conference
2021 IEEE International Integrated Reliability Workshop, IIRW 2021
DOI
10.1109/IIRW53245.2021.9635614
Language
English
Fraunhofer-Institut für Keramische Technologien und Systeme IKTS  
Keyword(s)
  • Chip-package-interaction (CPI)

  • FE simulation

  • indentation

  • piezo resistivity

  • reliability testing

  • ring oscillator (RO)

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