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Gains and challenges of parameterized finite element modeling of microelectronics packages
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2001
Conference Paper
Title
Gains and challenges of parameterized finite element modeling of microelectronics packages
Author(s)
Auersperg, J.
Döring, R.
Michel, B.
Mainwork
Mechanical reliability simulation characterisation testing
Conference
Workshop Micro Materials Testing and Simulation 2001
Language
English
Fraunhofer-Institut für Zuverlässigkeit und Mikrointegration IZM
