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2010
Conference Paper
Title
Simulation of the Interdiffusion at the Interface of Co-Sintered Parts
Abstract
The production of interfaces between different metals obtained via co-sintering techniques takes place in some processes. In this work, two component metal injection moulding (2CMIM) and stencil printing processes were investigated. For 2C-MIM, two material combinations (FeNi7/FeNi50 and 316L/17-4PH) were examined and the interdiffusion profiles of elements along the interfaces measured by EDX/SEM line scans. The results were compared with profiles in dense parts and bulk kinetic simulation using DICTRA/Thermo-Calc. The aim of this study was to identify the influences of the powder precursor on the interdiffusion zone. For the stencil printing, one multiphase combination (Fe30Cr40Ni30/316L) was investigated by interdiffusion profiles and the results compared with simulation. In general, for both processes, the simulation and experiments showed a good agreement. Consequently, the commercial simulation package (DICTRA/Thermo-Calc) transposed its advantages to 2C-MIM, sten cil printing and potentially could be used for other processes involving co-sintering technique.