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2020
Conference Paper
Title
Fundamental studies on the curing behavoir of porous CVD and spin-on dielectrics
Abstract
The network- and pore-properties in porous CVD and spin-on organosilicate glasses (OSG) were investigated by Fourier transform infrared (FTIR) and positron annihilation lifetime spectroscopy (PALS). Thermal treatments were carried out from room temperature up to 450 °C to observe the porogen degradation by forming a porous network. For spin-on dielectrics a complete porogen removal was achieved at 450 °C creating a mean pore diameter of 3.1 nm, whereas a onset of pore inter-connectivity was precisely estimated at around 400 °C.
Author(s)
Mainwork
2020 IEEE International Interconnect Technology Conference Iitc 2020
Conference
2020 IEEE International Interconnect Technology Conference, IITC 2020