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  4. Fundamental studies on the curing behavoir of porous CVD and spin-on dielectrics
 
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2020
Conference Paper
Title

Fundamental studies on the curing behavoir of porous CVD and spin-on dielectrics

Abstract
The network- and pore-properties in porous CVD and spin-on organosilicate glasses (OSG) were investigated by Fourier transform infrared (FTIR) and positron annihilation lifetime spectroscopy (PALS). Thermal treatments were carried out from room temperature up to 450 °C to observe the porogen degradation by forming a porous network. For spin-on dielectrics a complete porogen removal was achieved at 450 °C creating a mean pore diameter of 3.1 nm, whereas a onset of pore inter-connectivity was precisely estimated at around 400 °C.
Author(s)
Koehler, Nicole
Technische Universität Chemnitz
Attallah, Ahmed Gamal
HZDR - Helmholtz-Zentrum Dresden-Rossendorf
Liedke, Maciej Oskar
Technische Universität Chemnitz
Butterling, M.
Technische Universität Chemnitz
Hirschmann, Eric
HZDR - Helmholtz-Zentrum Dresden-Rossendorf
Ecke, Ramona
Fraunhofer Institute for Electronic Nano Systems ENAS  
Wagner, Andreas
HZDR - Helmholtz-Zentrum Dresden-Rossendorf
Schulz, Stefan E.  
Fraunhofer Institute for Electronic Nano Systems ENAS  
Mainwork
2020 IEEE International Interconnect Technology Conference Iitc 2020
Funder
Deutsche Forschungsgemeinschaft  
Conference
2020 IEEE International Interconnect Technology Conference, IITC 2020
DOI
10.1109/IITC47697.2020.9515601
Language
English
Fraunhofer-Institut für Elektronische Nanosysteme ENAS  
Keyword(s)
  • curing

  • DBS

  • FTIR

  • OSG

  • PALS

  • porogen removal

  • porous dielectrics

  • ULK

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