Novel technology options for multilayer-based ceramic microsystems

Ceramic multilayer technologies as LTCC (Low Temperature Cofired Ceramics) or HTCC (High Temperature Cofired Ceramics) are applied for the fabrication of highly integrated ceramic microelectronic packages. Furthermore ceramic multilayer technologies offer the possibility of the additional integration of 3-D-structures for multilayer-based microsystems. The paper presents a new machine for tape/ multilayer structuring combining micro punching tools and micro UV-laser ablation/ cutting. The application for the production of different multilayer based components is described (e.g. LTCC-based PEM fuel cell system, LTCC-based pressure sensors). Aerosol printing is a new technology e.g. for rapid prototyping for LTCC multilayer and 3-D-deposition of functional layers on LTCC. Advantages and limitations of the technology are discussed.