Temperature Dependent RF Characterization of Thin-Film Polyimide for 5G mmWave Antenna-in-Package Modules

In this paper, dielectric properties of thin-film materials in Fan-out Wafer Level Packages (FoWLP) used for the development of 5G mmWave Antenna-in-Package (AiP) modules are measured in the 5G New Radio (NR) frequency bands (26.5-29.5 GHz and 37-40 GHz) in dependency on temperature from 0°-150°C. The dielectric properties of the applied material show an increase in dielectric constant with respect to temperature and decrease in dielectric constant with respect to frequency, whereas dielectric loss has a tendency of increasing with respect to temperature and frequency.