A novel approach for RF/microwave modeling and optimization of BGA packages

A novel approach for RF/microwave modeling and optimization of ball grid array (BGA) packages is presented. Using the proposed methodology, wideband models that account for the parasitic contribution of all package components along complete signal paths (chip-to-board) were developed and validated. With the aid of these models, root causes of potential signal integrity (SI) problems were studied. Based on the results obtained, novel design measures were derived.