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1995
Conference Paper
Title

A novel resistor system for AlN

Other Title
Ein neues Widerstandssystem für AlN
Abstract
Aluminium nitride (AlN) represents, because of excellent physical and chemical properties, a real alternative to other substrate materials such as alumina and beryllia. Commercially available resistor pastes for alumina bubble on AlN during the firing process and so from nonfunctional layers. The paper introduces a resistor system with a compatible conductor paste and a glass encapsulant. The resistor system is based on ruthenium dioxide (RuO2) with a "non-reducible" glass by AlN. Because RuO2 reacts with AlN we had to find a powder composition allowing gaseous product to escape the layer. A high stability can be achieved by an encapsulation.
Author(s)
Kretzschmar, C.
Otschik, P.
Schoene, F.
Jaenicke-Rößler, K.
Mainwork
10th European Microelectronics Conference 1995. Proceedings  
Conference
European Microelectronics Conference 1995  
Language
English
Fraunhofer-Institut für Keramische Technologien und Systeme IKTS  
Keyword(s)
  • AlN

  • Dickschicht

  • Glas

  • Glass

  • palladium

  • reliability

  • RuO2

  • Silber

  • silver

  • thick films

  • Zuverlässigkeit

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