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  4. Reliablility of SnPb and Pb-Free Flip-Chips under Different Test Conditions
 
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2007
Journal Article
Title

Reliablility of SnPb and Pb-Free Flip-Chips under Different Test Conditions

Author(s)
Spraul, M.
Nüchter, W.
Möller, A.
Wunderle, B.
Michel, B.
Journal
Microelectronics reliability  
Language
English
Fraunhofer-Institut für Zuverlässigkeit und Mikrointegration IZM  
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