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Processing of Teflon AF 1601 for application as dielectric in high frequency multilayer metallizations for MCM-D
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1998
Conference Paper
Title
Processing of Teflon AF 1601 for application as dielectric in high frequency multilayer metallizations for MCM-D
Author(s)
Kiesbye, H.
Strunskus, T.
Gulde, P.
Neumann, G.
Mainwork
EuPac '98. 3rd European Conference on Electronic Packaging Technology & 9th International Conference on Interconnection Technology in Electronics. Lectures and poster
Conference
European Conference on Electronic Packaging Technology (EuPac) 1998
International Conference on Interconnection Technology in Electronics 1998
Language
English
Fraunhofer-Institut für Siliziumtechnologie ISIT
