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2007
Conference Paper
Title

Fully integrated one phase liquid cooling system for organic boards

Abstract
Prime concerns in designing liquid cooling solutions are performance, reliability and price. To that end a one-phase liquid cooling concept is proposed, where all pumps, valves and piping are fully integrated on board level. Only low-cost organic board technology and SMT processes are used in the design. This paper addresses the key issues of such a concept together with some numerical and first experimental results. It is highlighted that for such a concept a special type of membrane pump with adequate valve technology is especially suitable. Design guidelines as to its performance are given. Eventually, the obtained results are evaluated with respect to the requirements and necessary further developments are commented on to make the concept eligible for the cost-performance-sector.
Author(s)
May, D.
Wunderle, B.
Schindler-Saefkow, F.
Nguyen, B.
Schacht, R.
Michel, B.
Reichl, H.
Mainwork
13th International Workshop on Thermal Investigation of ICs and Systems, 2007, THERMINIC 2007. Electronic Resource  
Conference
International Workshop on Thermal Investigation of ICs and Systems 2007  
Open Access
DOI
10.1109/THERMINIC.2007.4451768
Language
English
Fraunhofer-Institut für Zuverlässigkeit und Mikrointegration IZM  
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