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  4. 4 x 200 Gb/s EML-Array with a Single MQW Layer Stack
 
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2023
Conference Paper
Title

4 x 200 Gb/s EML-Array with a Single MQW Layer Stack

Abstract
We demonstrate an EML-array for up to 4x200 Gb/s PAM4 modulation at 45°C. Its single MQW layer stack design allows for low-cost fabrication. The device is optimized for equal performance over four LAN-WDM wavelength channels.
Author(s)
Theurer, Michael
Fraunhofer-Institut für Nachrichtentechnik, Heinrich-Hertz-Institut HHI  
Kottke, Christoph  
Fraunhofer-Institut für Nachrichtentechnik, Heinrich-Hertz-Institut HHI  
Freund, Ronald  
Fraunhofer-Institut für Nachrichtentechnik, Heinrich-Hertz-Institut HHI  
Ganzer, Felix
Fraunhofer-Institut für Nachrichtentechnik, Heinrich-Hertz-Institut HHI  
Runge, Patrick  
Fraunhofer-Institut für Nachrichtentechnik, Heinrich-Hertz-Institut HHI  
Möhrle, Martin  
Fraunhofer-Institut für Nachrichtentechnik, Heinrich-Hertz-Institut HHI  
Troppenz, Ute  
Fraunhofer-Institut für Nachrichtentechnik, Heinrich-Hertz-Institut HHI  
Sigmund, Ariane
Fraunhofer-Institut für Nachrichtentechnik, Heinrich-Hertz-Institut HHI  
Schell, Martin  
Fraunhofer-Institut für Nachrichtentechnik, Heinrich-Hertz-Institut HHI  
Mainwork
Optical Fiber Communications Conference and Exhibition, OFC 2023. Proceedings  
Project(s)
Fabrication and assembly automation of TERabit optical transceivers based on InP EML arrays and a Polymer Host platform for optical InterConnects up to 2 km and beyond  
Funder
European Commission  
Conference
Optical Fiber Communication Conference 2023  
DOI
10.23919/OFC49934.2023.10116734
Language
English
Fraunhofer-Institut für Nachrichtentechnik, Heinrich-Hertz-Institut HHI  
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