2016
Conference Paper
Title

Multi-chip integration by photonic wire bonding: Connecting surface and edge emitting lasers to silicon chips

Abstract
We demonstrate coupling of surface and edge emitting InP lasers to silicon photonic chips using photonic wire bonding. We confirm that back-reflections from the silicon chip do not deteriorate the linewidth of the lasers.
Author(s)
Hoose, T.
Billah, M.
Blaicher, M.
Marin, P.
Dietrich, P.-I.
Hofmann, A.
Troppenz, U.
Möhrle, M.
Lindenmann, N.
Thiel, M.
Simon, P.
Hoffmann, J.
Goedecke, M.L.
Freude, W.
Koos, C.
Mainwork
Conference
Open Access
DOI
Additional link
Language
English