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  4. Mold based D-band slotted SIW bandpass filter
 
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2022
Conference Paper
Title

Mold based D-band slotted SIW bandpass filter

Abstract
D-band substrate integrated waveguide (SIW) bandpass filter with slots based on mold compound was manufactured and measured. The investigation shows the high potential of SIW filters to be integrated in packages using fan-out wafer level packaging (FOWLP). The manufactured sample was inspected using microscope to validate the measurements. The second order filter configuration demonstrates good selectivity properties. The measurements and full-wave modelling demonstrate a very good correlation in terms of magnitude and phase of return and insertion losses.
Author(s)
Chernobryvko, Mykola
Fraunhofer-Institut für Zuverlässigkeit und Mikrointegration IZM  
Kanitkar, Abhijeet Mohan
Fraunhofer-Institut für Zuverlässigkeit und Mikrointegration IZM  
Müller, Friedrich
Fraunhofer-Institut für Zuverlässigkeit und Mikrointegration IZM  
Schwanitz, Oliver
Fraunhofer-Institut für Zuverlässigkeit und Mikrointegration IZM  
Ndip, Ivan  
Fraunhofer-Institut für Zuverlässigkeit und Mikrointegration IZM  
Schneider-Ramelow, Martin  
Fraunhofer-Institut für Zuverlässigkeit und Mikrointegration IZM  
Murugesan, Kavin Senthil
Fraunhofer-Institut für Zuverlässigkeit und Mikrointegration IZM  
Braun, Tanja  
Fraunhofer-Institut für Zuverlässigkeit und Mikrointegration IZM  
Mainwork
IEEE 9th Electronics System- Integration Technology Conference, ESTC 2022. Conference Proceedings  
Project(s)
ForMikro 6GKom  
Funder
Bundesministerium für Bildung und Forschung  
Conference
Electronics System-Integration Technology Conference 2022  
DOI
10.1109/ESTC55720.2022.9939507
Language
English
Fraunhofer-Institut für Zuverlässigkeit und Mikrointegration IZM  
Keyword(s)
  • 6G

  • bandpass

  • D-band

  • fan-out wafer level packaging

  • filter

  • mold

  • Substrate integrated waveguide

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